Though we tailor our process to each project, there are typically four phases:
Architecture. Component selection, signal and power block diagrams, collaboration on the mechanical control outline, breadboarding and simulation, the non-form-factor schematics and layout, the firmware architecture and test framework, device drivers on dev kits, OTA update support, and bring-up.
Form factor. The improvements from the non-form-factor build folded in, collaboration on the detailed MCO, final schematics and layout, firmware application development, cloud and device interfacing, manufacturing support and a second bring-up.
Manufacturing prep. Automated test fixture design, DFM improvements, collaboration with the contract manufacturer, support for regulatory and environmental testing, firmware feedback from user trials, and EVT, DVT, PVT and mass production management.
Post-launch. Bringing the BOM cost down, RMA triage, statistical process control, support for the line, OTA updates going out to users, fleet management of the data coming back from the field, support of the IC supply chain, and a formal hand-off of the design.
There is more detail on how we work.